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Amkor Technology, Inc.

TickerAMKRVenueUSSectorTechnologyPrimary listingBeta2.23
$41.82-5.06%
FinScore54

Amkor Technology, Inc. is a United States-based company in the Technology sector with a market capitalisation of $10.4B. Its FinScore is 54/100; its highest-scoring layer is Quality (65) and its lowest is Momentum (15). The shares trade at 18.7x trailing earnings and are down 3% year to date.

Market cap
$10.4B
P/E (TTM)
18.7x
Dividend yield (TTM)
0.80%
ROE
12.4%

Share price performance

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About Amkor Technology, Inc.

amkor.com

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Profile
Sector
Technology
Industry
Semiconductors
HQ
United States
Fiscal year-end
December
Trading currency
USD
Reporting currency
USD
Fundamentals updated
83 days ago
Market
Market cap
$10.4B
Shares outstanding
248.5M
P/E (TTM)
18.7x
Dividend yield (TTM)
0.80%
Beta (issuer)
2.22
Revenue (latest FY)
$6.7B

Revenue breakdown

FY 2025$6.7B
  • Advanced Products
    82.8%$5.6B
  • Mainstream Products
    17.2%$1.2B

FinScore

As of 2026-10-19
Overall54
Quality65
Growth56
Value50
Momentum15
Relative Strength52

Snapshot

Ownership

As of 2026-06-30
Institutional
47.9%
Insider
0.0%
Free float
43.7%
Top-5 institutional holders
17.2%
Shares outstanding
248.5M
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